It’s clearly to get rid of moisture, probably to keep the steam from pushing BGAs or CSP packages off the board (maybe from moisture trapped in tented vias, micro vias or other places).
Read More: Bare PCB: A Beginner’s Guide to Definition, Benefits, and Testing
#PCB Manufacturing
A design engineer told me our PCB prototypes would be completed soon and then he would have his assembler “run a panel”. Does anyone know what that means?
I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (thus, higher temperature) process?
Many assembly factories are asking for SMT jobs, while I think through hole would be a better option for a high voltage application. Before the high voltage project is started, we need to make a call on SMT or Through hole parts. Is there a study on this?
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