“Zig zags” are used to ensure a group of traces are all the same length. It makes sure that signal from various paths arrives at roughly the same time, reducing latency and sync issues.
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How does a conventional board house deal with the issue of reflow during PCB component assembly with BGA’s on both sides of the board?
Are two different solders used (like regular lead free SAC305 and a low temp?)
We found that edge-mounting a TO-Can package to a PCB will really save a lot on manufacturing. However, it comes with fairly long through-hole pins that are taking up too much space to reach the pads. Any suggestion?
I received the price breakdown of PCB quotation from my suppliers. The tooling fee is not so pretty. What is this process and can we skip it to save the cost?
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