Why are there no BGA chips with triangular tessellation of circular pads?

A triangular tiling would allow π⁄√12 or 90.69% of the footprint to be reserved for the solder balls and the surrounding clearance, while the ubiquitous square tiling only allows π/4 or 78.54% of the footprint to be used. Why are there no BGA chips with triangular tessellation?

PCB Assembly, PCB Design
October 31, 2023

Unless you use via-in-pad, which costs more, you need room to put routing vias in between the pads.

#PCB Assembly #PCB Design

Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.

Oliver Smith

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