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https://www.youtu.be/E-F1Z2kP9Cs?si=1-qNY8UKyFjYzkZ_
There is nothing about weight in the substrate datasheets I found.
Between CEM-3 or FR4, which is the lightest material ? What is the average weight by surface for CEM-3 boards ?
Many assembly factories are asking for SMT jobs, while I think through hole would be a better option for a high voltage application. Before the high voltage project is started, we need to make a call on SMT or Through hole parts. Is there a study on this?
After We have assembled the Virtex-4 FPGA BGA package on our custom design PCB, we check for short circuits between all power grounding and they shows short cut between each other. Please tell us about any process for debugging this issue.
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