It means lC and component which is connected to Ground. If a Ground plane is made as a separate layer, all these pins are to be connected. It can boost the performance of circuitry in certain conditions.
Sometimes vias are used for connections to ground planes.
Read More: Types of PCB Layers and Optimization
#PCB Design
I ordered PCBA for IoT device and received the hardware product with good quality. However, there is a process I ignored before – firmware development based on the hardware. How should I move on?
My project have gone through from design, prototype to mass production after lots of discussion and adjustment. Now the manufacturer are making our products in their product lines. And I would like to know is there any differences between the prototypes in my hand now and the final products output by the manufacturer?
I’d like to use a processor that uses a pin grid array. Basically, I’d like to make the prototyping PCB board for it. I’m new to eagle. How can I connect the inner PGA pins to the header pins on the edge (without shorting the lines)?
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