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HFSS aracıyla mikro şerit anten tasarlarken alınması gereken FR4 alt katmanının kalınlığı nedir??

HFSS geçiş ücretine sahip bir mikro şerit anten tasarlıyorum, what's the thickness of FR4 substrate that one should take ?

As I recall, most FR4 stock is .062in thick. The thickness of the stock is not quite as important as to your specification of the stock.

One can have a PCB house plate copper onto the standard board stock to your specs, which might be more useful in your micro-strip design parameter selection.

To be fair, rağmen, I am unfamiliar with the software tool you mentioned. I had to do the design the hard way and tweak as necessary.

Açıklama:

  • If the board is single-sided, then the above is true. The copper thickness is more important than the substrate itself.
  • If one is using a two-sided, or multilayered design, the thickness of the stock is one more difficulty to be solved in designing your micro-strip elements., especially the distance to a ground plane.

Devamını oku: Doğru PCB Kalınlığı Nasıl Seçilir??

#PCB Tasarımı #PCB Malzemeleri

Resmi Oliver Smith

Oliver Smith

Oliver, PCB tasarımı konusunda yetenekli deneyimli bir elektronik mühendisidir, analog devreler, gömülü sistemler, ve prototipleme. Derin bilgisi şematik yakalamaya kadar uzanıyor, cihaz yazılımı kodlaması, simülasyon, Yerleşim, test yapmak, ve sorun giderme. Oliver, elektrik tasarımı yeteneklerini ve mekanik yeteneğini kullanarak projeleri konsept aşamasından seri üretime geçirme konusunda uzmandır.
Resmi Oliver Smith

Oliver Smith

Oliver, PCB tasarımı konusunda yetenekli deneyimli bir elektronik mühendisidir, analog devreler, gömülü sistemler, ve prototipleme. Derin bilgisi şematik yakalamaya kadar uzanıyor, cihaz yazılımı kodlaması, simülasyon, Yerleşim, test yapmak, ve sorun giderme. Oliver, elektrik tasarımı yeteneklerini ve mekanik yeteneğini kullanarak projeleri konsept aşamasından seri üretime geçirme konusunda uzmandır.

Başkaları Ne Soruyor?

What will be the role of a copper layer in a metal core PCB in thermal dissipation?

In the design of a power electronic PCB, I want to use a metal PCB for heat dissipation of a TO-220 package MOSFET. To do that I want to mount metal PCB on the MOSFET with the use of thermal paste and screw exactly like we do when we use heatsink for the same package. Should I leave the copper of PCB between MOSFET surface and dielectric of PCB or remove the copper surface and leave only the dielectric opening?

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