(Even the soldering process is under the suggested temperature.)
1.Component’s lead temperature is too cold and cannot form a good solder join.
2.Through-Hole Dimensions on the PCB are insufficient (too small)
3.Physical damage to the solder joint after soldering
Lehimlemeden sonra, some processes may cause physical stress and fracturing, such as installing a heat sink on the surface, or installing unfitted plastic case molding.
Devamını oku: Açık Delik Bileşenleri: Vintage Teknoloji PCB'lerde Hala Anahtar
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