Neden açık delikli bileşenler PCB'ye doğru şekilde lehimlenemiyor??

(Even the soldering process is under the suggested temperature.)

1.Component’s lead temperature is too cold and cannot form a good solder join.

2.Through-Hole Dimensions on the PCB are insufficient (too small)

3.Physical damage to the solder joint after soldering
Lehimlemeden sonra, some processes may cause physical stress and fracturing, such as installing a heat sink on the surface, or installing unfitted plastic case molding.

Devamını oku: Açık Delik Bileşenleri: Vintage Teknoloji PCB'lerde Hala Anahtar

#PCB Assembly #THT PCB Assembly #Manufacturing