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BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (written) information identifying the component.
Devamını oku: BGA PCB Meclisi
#PCB Montajı
Çatı bağlantısı nedeniyle depoda bir PCB partisi ıslandı. Kayıpları omuzlamak çok korkunç. Bu ıslak PCB'leri kurtarmak için nasıl yapabilirim?? Veya hasarı en aza indirmek için?
Tedarikçilerimden gelen her türlü PCB numunesinin yer düzlemleri olduğunu buldum. Önemli görünüyor ve işlevi hakkında bilgi edinmek istiyorum.
According to IPC-7351, the cathode should be on the left for a molded diode. ancak, when I use component wizard of my suppliers to create a diode, it places the cathode (K) on the right. Does it depend on the manufacturer? How does the assembly house know which way is correct?
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