The space between copper planes can act as waveguides for RF frequencies. It makes trace impedance changes and signal losses.
To cut such waveguide effect, put vias, which is essentially a copper cylinder.
When the distances between vias are small enough compared to the wavelength, the board is like continuous copper material, instead of waveguide.
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I’m using some 0.1% precision 10k and 150k resistors. They are thin film 0603 surface mount. For a lot more, there are also thick film types. Fundamentally and practically, what is the difference between these two?
De acordo com IPC-7351, o cátodo deve estar à esquerda para um diodo moldado. Contudo, quando uso o assistente de componentes dos meus fornecedores para criar um diodo, coloca o cátodo (K) à direita. Depende do fabricante? Como a casa de montagem sabe qual caminho é o correto?
I am prototyping a PCB, using Chip Quik’s “SMDSWLF.031, a Sn96.5/ Ag3.0/ Cu0.5 solder with 2.2% no-clean flux. I find that the black spots appears frequently in larger pads on my board. I wonder if it is because I left the soldering iron more time heating the solder and that burnt the flux. What is that black residue? Is that a sign of a bad joint or maybe bad soldering technique?
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