Assembléia PCB

Qual a utilidade dos relevos térmicos nas vias para vazamento de cobre?

  1. Easier routing and fan-out of BGAs and other dense parts. Particularly when putting planes under the BGA.
  2. Greater heat transfer to the planes on the PCB. You see this the most on QFNs and other packages with a ground pad on the bottom of the part in the center. This pad is intended to transfer heat to vias and then to the ground plane.
  3. There is less chance for the via to get messed up due to plating, drill accuracy issues, or other PCB manufacturing problems (not a huge benefit, but a benefit nonetheless).

consulte Mais informação: PCB de cobre pesado

#PCB manufacturing #PCB Materials

OliverSmith

Oliver é um engenheiro eletrônico experiente, especializado em design de PCB, circuitos analógicos, sistemas embarcados, e prototipagem. Seu profundo conhecimento abrange a captura esquemática, codificação de firmware, simulação, disposição, teste, e solução de problemas. Oliver se destaca em levar projetos desde o conceito até a produção em massa usando seus talentos de design elétrico e aptidão mecânica.

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