(Even the soldering process is under the suggested temperature.)
1.Component’s lead temperature is too cold and cannot form a good solder join.
2.Through-Hole Dimensions on the PCB are insufficient (too small)
3.Physical damage to the solder joint after soldering
Depois de soldar, some processes may cause physical stress and fracturing, such as installing a heat sink on the surface, or installing unfitted plastic case molding.
consulte Mais informação: Componentes de furo passante: Tecnologia vintage ainda é fundamental em PCBs
#PCB Assembly #THT PCB Assembly #Manufacturing
While most people focus on the components and copper traces that make up PCBs, there's…
The right type of PCB material can make or break the performance of your electronics project.…
BGA reballing emerges as a critical repair technique for modern electronic devices. Hoje em dia, dispositivos eletrônicos…
Do you know what PCB stiffeners are? They are widely used in flex and rigid-flex…
No processo de fabricação de PCB, PCB warpage is a common problem that manufacturers would encounter.…
In the world of printed circuit board design and manufacturing, precision and accuracy are paramount.…