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Há algum problema se eu mudar 0805 também 0402 montagem em superfície ou menor?

Para reduzir o tamanho de um PCB, Provavelmente terei que usar componentes SM menores. Atualmente uso principalmente 0805 passivos, e estou pensando em ir 0402 ou menor. Além das considerações de dissipação de energia, quaisquer armadilhas das quais devo estar ciente ao fazer a transição?

0402 obviously is harder to hand assemble. If you need to get them assembled by machine, please notice the following tips.

  • The assembler’s pick & place machine can even handle 0402 at a good rate & produzem.
  • Double-sided load. Some boards just need this assembly step, like BGA often puts decoupling caps on the bottom of the board.
  • Propriedades elétricas. The obvious one is, claro, the power rating of resistors. Voltage rating is not only likely worse due to the physical smaller dimensions, but also consider the voltage bias degradation effect of ceramic class 2 capacitores. For smaller packages in same voltage/capacitance, this effect may be worse.

Por outro lado, some properties, like lead inductance, is lower. além do que, além do mais, sometimes you can put capacitors right at the chip pins for QFP style packages, while routing signals underneath the chip. In effect, the loop area for the decoupling capacitor is much much smaller than a larger size capacitor, which may be placed further away to comply with signal routing.

consulte Mais informação: Serviços de design e layout de PCB

#PCB Design

Foto de OliverSmith

OliverSmith

Oliver é um engenheiro eletrônico experiente, especializado em design de PCB, circuitos analógicos, sistemas embarcados, e prototipagem. Seu profundo conhecimento abrange a captura esquemática, codificação de firmware, simulação, disposição, teste, e solução de problemas. Oliver se destaca em levar projetos desde o conceito até a produção em massa usando seus talentos de design elétrico e aptidão mecânica.
Foto de OliverSmith

OliverSmith

Oliver é um engenheiro eletrônico experiente, especializado em design de PCB, circuitos analógicos, sistemas embarcados, e prototipagem. Seu profundo conhecimento abrange a captura esquemática, codificação de firmware, simulação, disposição, teste, e solução de problemas. Oliver se destaca em levar projetos desde o conceito até a produção em massa usando seus talentos de design elétrico e aptidão mecânica.

O que os outros estão perguntando

How much larger should a plated-through hole be than lead diameter to get good solder wetting?

I’m designing a new PCB where I have a whack of connectors that have to line up with the metalwork. There are some problematic connectors. All 4 pins are round. I want to have the holes as small as possible while allowing for good solder adhesion over the full length of the pin. I’m looking for guidance on how much clearance around the component lead I should have in order to get good solder wetting and adhesion.

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