BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (written) information identifying the component.
consulte Mais informação: Assembléia PCB BGA
#Assembléia PCB
While most people focus on the components and copper traces that make up PCBs, there's…
The right type of PCB material can make or break the performance of your electronics project.…
BGA reballing emerges as a critical repair technique for modern electronic devices. Hoje em dia, dispositivos eletrônicos…
Do you know what PCB stiffeners are? They are widely used in flex and rigid-flex…
No processo de fabricação de PCB, PCB warpage is a common problem that manufacturers would encounter.…
In the world of printed circuit board design and manufacturing, precision and accuracy are paramount.…