BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (written) information identifying the component.
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#Assembléia PCB
I am dealing with a project about a PCB with NFC antenna. We are designing PCB now. Do anyone know about the size of an NFC antenna if we want it operate in 10 centimeters?
Raramente usamos múltiplas camadas em nossas linhas de produtos, que cobrem todos os tipos de alarme de fumaça. Para que eles são necessários? Quaisquer vantagens?
My EDA software (PCAD, but I guess others do this too) adds thermal reliefs on vias in a copper pour. What’s the use? Vias aren’t soldered.
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