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BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (written) information identifying the component.
consulte Mais informação: Assembléia PCB BGA
#Assembléia PCB
I know the paste mask layer is also called the stencil layer. It’s only used for assembly. I want to know if the paste mask layer (camada superior e inferior) is necessary for through hole components. For SMD components I know the paste mask layer is required to solder the components. Is it necessary for through hole components?
Existem vários pads redondos nos protótipos de PCB feitos pelo fabricante. Eles são marcados como Scx e rotulados com TP. O que eles são?
Para meu entendimento, cada processo no sistema operacional contém seu próprio bloco de controle de processo separado. Alguém pode me explicar isso. Cada processo possui seu próprio PCB ou existe apenas um PCB que contém todas as informações de todos os processos??
Mercados
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