You can refer to the following table.
| Ball Dia. | Reduction | Land Pattern Density Level | Land Dia. | Land Variation |
| 0.15 | 15% | C | 0.13 | 0.15-0.10 |
| 0.20 | 15% | C | 0.17 | 0.20-0.14 |
| 0.25 | 20% | B | 0.20 | 0.20-0.17 |
| 0.30 | 20% | B | 0.25 | 0.25-0.20 |
| 0.35 | 20% | B | 0.30 | 0.35-0.25 |
| 0.55 | 25% | UMA | 0.40 | 0.45-0.35 |
consulte Mais informação: Assembléia PCB BGA
#PCB Design
BGA reballing emerges as a critical repair technique for modern electronic devices. Hoje em dia, dispositivos eletrônicos…
Do you know what PCB stiffeners are? They are widely used in flex and rigid-flex…
No processo de fabricação de PCB, PCB warpage is a common problem that manufacturers would encounter.…
In the world of printed circuit board design and manufacturing, precision and accuracy are paramount.…
Soldering is a cornerstone technique in electronics assembly, it's used to connect electrical pieces and…
Hoje em dia, electronic products are both compact and lightweight while performing a variety of functions. este…