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Posso projetar elementos SMD na parte traseira do THT??

I'm designing a PCB right now and found out I can save a lot of space using the back of THT elements. Is it legit to design like that? Are there any problems that might occur?

If you want to meet CE requirements for noise immunity and emissions, a two-layer board would help a lot.

De um modo geral, there is no problem with putting components on both sides of the board, in the same place. If you had a two (or more) placa de camada, you’d probably want to put a ground or power plane between them. Contudo, you can’t do that with a single-layer board. So you should watch out for a fast digital chip interfering with an analog circuit. It would be inadvisable.

Por exemplo, put a microcontroller on one side and a high input impedance buffer on the other. But putting decoupling caps opposite the chip is probably a good plan.

consulte Mais informação: Fabricação de eletrônicos de telecomunicações

#PCB Design

Foto de OliverSmith

OliverSmith

Oliver é um engenheiro eletrônico experiente, especializado em design de PCB, circuitos analógicos, sistemas embarcados, e prototipagem. Seu profundo conhecimento abrange a captura esquemática, codificação de firmware, simulação, disposição, teste, e solução de problemas. Oliver se destaca em levar projetos desde o conceito até a produção em massa usando seus talentos de design elétrico e aptidão mecânica.
Foto de OliverSmith

OliverSmith

Oliver é um engenheiro eletrônico experiente, especializado em design de PCB, circuitos analógicos, sistemas embarcados, e prototipagem. Seu profundo conhecimento abrange a captura esquemática, codificação de firmware, simulação, disposição, teste, e solução de problemas. Oliver se destaca em levar projetos desde o conceito até a produção em massa usando seus talentos de design elétrico e aptidão mecânica.

O que os outros estão perguntando

What will be the role of a copper layer in a metal core PCB in thermal dissipation?

In the design of a power electronic PCB, I want to use a metal PCB for heat dissipation of a TO-220 package MOSFET. To do that I want to mount metal PCB on the MOSFET with the use of thermal paste and screw exactly like we do when we use heatsink for the same package. Should I leave the copper of PCB between MOSFET surface and dielectric of PCB or remove the copper surface and leave only the dielectric opening?

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