Jakie są możliwe rozwiązania problemów z wypaczeniami PCB?

The problem you mentioned is due to an imbalance in thermal expansion/shrink between layers (in this case copper vs base material, like laminate). When the copper from one side of PCB is completely etched it tends to warp when the copper on the other side cools. It happens when there is the non-even number of layers.

Rozwiązanie:

• Use double-sided PCB (or any even number of layers)
• Instead of solid copper, try to use grid copper, which is named “hatch” in the PCB CAD program.

Czytaj więcej: Automatyczna kontrola optyczna (AOI)

#Produkcja PCB