(miven the soldering process is under the suggested temperature.)
1.Component’s lead temperature is too cold and cannot form a good solder join.
2.Through-Hole Dimensions on the PCB are insufficient (too small)
3.Physical damage to the solder joint after soldering
Po lutowaniu, some processes may cause physical stress and fracturing, such as installing a heat sink on the surface, or installing unfitted plastic case molding.
Czytaj więcej: Komponenty otworów przelotowych: Vintage Tech nadal kluczowy w PCB
#PCB Assembly #THT PCB Assembly #Manufacturing
