The recommended footprint is for through-hole mounting. It is referred as an SIP package, which stands for the single inline package.
It would be best to mount it this way. If the design did absolutely not permit this, then you could probably lay long rectangular pads on a PCB and mount them like a SMD component. Beware you may have to de-rate the thermal properties of the IC, as it was likely tested while through-hole mounted.
You could always use a header, but that would only be warranted if you felt you would need to replace or change this component often.
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