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We found that edge-mounting a TO-Can package to a PCB will really save a lot on manufacturing. jednak, it comes with fairly long through-hole pins that are taking up too
Na mojej małej płytce PCB zamontowany jest bardzo czuły, delikatny czujnik na górnej powierzchni, który należy połączyć drutem z płytką drukowaną, so I am trying to design a
I am prototyping a PCB, using Chip Quik’s “SMDSWLF.031, a Sn96.5/ Ag3.0/ Cu0.5 solder with 2.2% no-clean flux. I find that the black spots appears frequently in larger pads on
Chciałbym użyć procesora korzystającego z układu siatki pinów. Gruntownie, Chciałbym wykonać do niego prototypową płytkę PCB. Jestem nowy w Eagle. How can I
I’m making a 4 layer PCB prototype that uses a bluetooth mcu connected to a 2.4GHz chip antenna. I’m thinking about what to do with the feedline, whether it should
I’m designing a PCB right now and found out I can save a lot of space using the back of THT elements. Is it legit to design like that? Czy
Many assembly factories are asking for SMT jobs, while I think through hole would be a better option for a high voltage application. Before the high voltage project is started,
Suppose one is hand-assembling a board with many SMT components. Unlike THT, SMT components are often not labeled. How might one keep small (<100) quantities of such parts properly organized
We are new brand of medical device. We are doing a device development recently. How can we find PCB schematics for reference?
I’m working on a project which requires the use of a CSP package. The product’s datasheet provides ball pitch and ball diameter but nothing about the preferred land pad diameter.<br
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