As a former circuit board (and flex circuit) designer, I would expect vias in flex circuits to be about as reliable as in more traditional (sztywny) laminates. Factors that would influence reliability include:
In the case of item #4, I would advocate for a “teardrop” shaped pad, to smooth the transition from the trace to the via pad.
This will tend to reduce fracturing where the trace enters the via pad on the flex circuit.
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