As a former circuit board (and flex circuit) designer, I would expect vias in flex circuits to be about as reliable as in more traditional (sztywny) laminates. Factors that would influence reliability include:
- The amount of vibration and mechanical stress applied to the flex over its lifetime
- The thickness of the wall plating in the plated through holes (aka vias)
- The quality of manufacture (a flex circuit built by a fab that has experience with the technology will more likely build a reliable part)
- The layout of the via pads themselves
In the case of item #4, I would advocate for a “teardrop” shaped pad, to smooth the transition from the trace to the via pad.
This will tend to reduce fracturing where the trace enters the via pad on the flex circuit.
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#Montaż PCB
