De elektronische apparaten ontwikkelen zich snel, ze vereisen compacte ontwerpen en efficiëntie. Tussen de vele keuzes die er toe doen, QFN-pakketten zijn een populaire keuze aller tijden. What makes this type of package so popular? Should you use it in your projects too? This guide takes a clear and comprehensive look at it.
QFN stands for Quad Flat No-leads. QFN packages attach silicon dies (the ASIC) to a printed circuit board (PCB). It is implemented using surface-mount technology. Zoals de naam al doet vermoeden, this package did not include the classical leads that used to be there in the past. Instead of having usual leads, Quad flat no-lead packages have edge pads with an open solder pad under. This structure can improve electrical and thermal performance, and that’s why QFN packages are very popular among users.
A QFN package generally consists of the following basic components:
Lead Frame: This part is very critical in determining the performance of the IC. It basically serves as the support for the package.
Single or Multiple Dies: These are actually the silicon chips inside the package and are mounted to the circuit board using the surface-mount technique.
Wire Bonds: These are usually made of copper or gold. These wires form the necessary connections between the lead frame and the dies.
Molding Compound: This material surrounds and protects the internal components. It provides electrical insulation, prevents corrosion, and strengthens the durability and reliability of the package.
QFN packages may also be divided into two main types depending on the manufacturing process:
Punch type QFN: This style is produced with one mold cavity. After the molding process a special tool is used to punch out each individual package from the molded matrix. This method is very productive for mass production and usually results in a clean, sharp cut.
Sawn type QFN: Aan de andere kant, sawed type QFNs are produced through the mold array process. This involves the process of making a large sheet of molded packages cut out into individual units using a saw. The technology is very efficient in managing large volumes.
QFP and QFN are the two most common integrated circuit packages. Although their names differ only by one letter, the QFP package features gull-wing leads that protrude from the package body. This is very helpful when inspecting or reworking it, and at the same time, it is quite compact.
QFNs will have better thermal dissipation because the die pad is exposed, and this type of design enables more heat to be transferred to the PCB. Echter, QFNs are difficult to visually inspect and rework due to the fact that the solder joints will be buried under the package.
Consider the space in the board for the component, the need for thermal performance, and the capabilities of the manufacturing process. If the need is space and thermal performance, then QFNs might be the choice, but if ease of inspection and ease of rework is what is needed, then QFPs can be the better alternative.
Further reading: IC-pakkettypen: Hoe u de juiste kiest?
QFN packages are especially popular in sectors where saving space and having top performance are of paramount importance. QFNs are used in the following sectors:
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