It’s clearly to get rid of moisture, probably to keep the steam from pushing BGAs or CSP packages off the board (maybe from moisture trapped in tented vias, micro vias or other places).
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After We have assembled the Virtex-4 FPGA BGA package on our custom design PCB, we check for short circuits between all power grounding and they shows short cut between each other. Please tell us about any process for debugging this issue.
The PCB has a pulse oximeter mounted on the surface, and it’s tolerance is 0.6mm. The problem is the pulse oximeter needs to touch the bottom case at all times. How to best mount the PCB in the case without putting too much stress on the pulse oximeter? Will screws with flexible washers be all right? Sadly separating pulse oximeter from main PCB is not an option.
I receive the samples BOM of our PCBA factory. It remarks that PCB is FR4 Isola 370HR. What is this and is it reliable materials?
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