It’s clearly to get rid of moisture, probably to keep the steam from pushing BGAs or CSP packages off the board (maybe from moisture trapped in tented vias, micro vias or other places).
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I have a batch of PCBs with SMT nuts which has been assembled onto a PCB – the nut has kapton tape on top to allow easy pickup for assembly. How can we do this faster/what’s a better method?
We would like to do wave soldering for the through hole components. All through hole components are top side of PCB. Only test points, which require mask during process, are on the bottom side. So there is a extra labour cost at adding and removing the mask. Can we do wave solder the through hole parts without masking it?
On a Flex Printed Circuit (FPC) made out of Kapton polyimide, will anything bad happen if I put a VIA in a part of the FPC that has to bend? VIA size: 0.2 mm hole diameter in 0.4 mm copper diameter. FPC bend radius: 0.7 mm. Kapton thickness: 0.2 mm. Copper weight: either 2 oz or 1 oz (I haven’t decided yet)
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