Why does the manufacturer use a flying probe tester when they already have an in-circuit tester?

Last week, I visit a PCBA manufacturer for our new project. They not only introduce in-circuit tester but also flying probe tester, which can both ensure the quality level. Zo, Why does the manufacturer use a flying probe tester when they already have an in-circuit tester?

In-circuit test fixtures are built specifically for a given PCB design (unless they have removable pogo-pin cassettes), which is a limitation. Echter, they generally only cost hundreds of dollars and they can simultaneously connect with all of the test points on one side of the PCB.

Flying probe test systems are more flexible because they can be reprogrammed for an ever-changing variety of PCBs. But the machines cost tens of thousands of dollars and they have a limited number of probes, which can make them unsuitable for loading firmware into the boards.

#PCB Assembly #PCB Testing

https://www.youtu.be/OBGCjMzoJ0c?si=q_udfAIg-6CzPPkT

Picture of Olivier Smit

Olivier Smit

Oliver is een ervaren elektronica-ingenieur met kennis van PCB-ontwerp, analoge circuits, ingebedde systemen, en prototyping. Zijn diepgaande kennis omvat schematisch vastleggen, firmware-codering, simulatie, indeling, testen, en probleemoplossing. Oliver blinkt uit in het omzetten van projecten van concept naar massaproductie met behulp van zijn elektrische ontwerptalenten en mechanische vaardigheden.
Picture of Olivier Smit

Olivier Smit

Oliver is een ervaren elektronica-ingenieur met kennis van PCB-ontwerp, analoge circuits, ingebedde systemen, en prototyping. Zijn diepgaande kennis omvat schematisch vastleggen, firmware-codering, simulatie, indeling, testen, en probleemoplossing. Oliver blinkt uit in het omzetten van projecten van concept naar massaproductie met behulp van zijn elektrische ontwerptalenten en mechanische vaardigheden.

Wat anderen vragen

Can leaded BGA chips be reflow soldered with lead-free process?

I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (dus, higher temperature) werkwijze?

Can I design SMD elements on the back of THT?

I’m designing a PCB right now and found out I can save a lot of space using the back of THT elements. Is it legit to design like that? Are there any problems that might occur?

Lees gedetailleerd advies uit blogartikelen

Scroll naar boven