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Lees verder: PCB-ontwerp- en lay-outservices
#PCB Design #PCB Manufacturing
I know the paste mask layer is also called the stencil layer. It’s only used for assembly. I want to know if the paste mask layer (both top and bottom layer) is necessary for through hole components. For SMD components I know the paste mask layer is required to solder the components. Is it necessary for through hole components?
We found that edge-mounting a TO-Can package to a PCB will really save a lot on manufacturing. Echter, it comes with fairly long through-hole pins that are taking up too much space to reach the pads. Any suggestion?
I have three through-hole PCBs that are missing front and back solder mask openings for two of the components. The solder mask (usually green) is covering the front and back solder pads. All other pads for all other parts are exposed. Is there a good way to remove the solder mask so that I can solder the components to the board?
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