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C for capacitance. R for resistance. CR for capacitive reactance circuit.
Alternating current can pass through the capacitor. When the capacitor is connected to the AC circuit, the charge on the capacitor plate has a hindering effect on the directional moving charge, which is called the capacitive reactance.
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My small PCB is mounting a very sensitive fragile sensor on the top surface that has to be wire bonded to the PCB, so I am trying to design a smaller PCB that can be surface mounted to the bigger PCB. How can I get some kind of thin footprint for interconnecting the two PCB boards?
A design engineer told me our PCB prototypes would be completed soon and then he would have his assembler “run a panel”. Does anyone know what that means?
I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (dus, higher temperature) werkwijze?
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