Solder paste is composed of metal micro balls and flux. The metal doesn’t change over time much, but the flux does. Any solvent that maintains flux viscosity can ‘dry up’ over time and the total mixture becomes less viscous. This is a problem in a manufacturing environment because it can lead to improper flux distribution along a footprint during the stenciling process (especially if the flux balls up or has an affinity for itself more than what it is being dispensed onto).
This is mostly a problem in large PCB assembly lines.
#PCB-assemblage
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