It means lC and component which is connected to Ground. If a Ground plane is made as a separate layer, all these pins are to be connected. It can boost the performance of circuitry in certain conditions.
Sometimes vias are used for connections to ground planes.
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I’m making a 4 layer PCB prototype that uses a bluetooth mcu connected to a 2.4GHz chip antenna. I’m thinking about what to do with the feedline, whether it should be buried on one of the middle layers, or left on the top layer. To get a 50 ohm line, should I choose top layer with 13-mil width or buried miccrostrip with 7-mild width?
I received the price breakdown of PCB quotation from my suppliers. The tooling fee is not so pretty. What is this process and can we skip it to save the cost?
We got a quotation sheet of four layers board but it greatly exceed our budget. So now we are thinking about reduce layers to save cost. Does this solution work?
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