It means lC and component which is connected to Ground. If a Ground plane is made as a separate layer, all these pins are to be connected. It can boost the performance of circuitry in certain conditions.
Sometimes vias are used for connections to ground planes.
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I’m working on a project which requires the use of a CSP package. The product’s datasheet provides ball pitch and ball diameter but nothing about the preferred land pad diameter.
How can the pad diameter be worked out from these figures assuming an NSMD land?
There is nothing about weight in the substrate datasheets I found.
Between CEM-3 or FR4, which is the lightest material ? What is the average weight by surface for CEM-3 boards ?
I usually work for PCB designing and know some useful design software. I want to know what design software you are using. Is there any high recommendation?
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