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On which layers of four should the trace antenna be (433mhz)

Our team plan to launch a GPS device for food safety tracking, with a four layers PCB inside. Where should we locate the antenna?

Antennas deal with the world outside the device. This would tend to indicate that they should be located on an outside layer.

While it’s easy to say that circuit board substrate material (woven Fiberglas with epoxy binder) is “transparent” to radio signals, a closer look reveals a dielectric constant of 4 as versus a dielectric constant of 1 for free space. This difference will have an effect on the behavior of the antenna (probably not much at 433 MHz), but it’s still not a good idea to bury the antenna under a layer of laminate.

Don’t locate any other conductors on layers below the antennajust keep them clear.

Lees verder: Wat is meerlagige PCB

#PCB-ontwerp

Picture of Olivier Smit

Olivier Smit

Oliver is een ervaren elektronica-ingenieur met kennis van PCB-ontwerp, analoge circuits, ingebedde systemen, en prototyping. Zijn diepgaande kennis omvat schematisch vastleggen, firmware-codering, simulatie, indeling, testen, en probleemoplossing. Oliver blinkt uit in het omzetten van projecten van concept naar massaproductie met behulp van zijn elektrische ontwerptalenten en mechanische vaardigheden.
Picture of Olivier Smit

Olivier Smit

Oliver is een ervaren elektronica-ingenieur met kennis van PCB-ontwerp, analoge circuits, ingebedde systemen, en prototyping. Zijn diepgaande kennis omvat schematisch vastleggen, firmware-codering, simulatie, indeling, testen, en probleemoplossing. Oliver blinkt uit in het omzetten van projecten van concept naar massaproductie met behulp van zijn elektrische ontwerptalenten en mechanische vaardigheden.

Wat anderen vragen

How do you usually organize SMT parts during PCB assembly?

Suppose one is hand-assembling a board with many SMT components. Unlike THT, SMT components are often not labeled. How might one keep small (<100) quantities of such parts properly organized during assembly? Are there particular tools? Storage devices? Methods?

Is aluminium foil a good substitute for kapon tape when soldering?

I want to desolder a tiny surface mount button from the motherboard of a phone. There are a lot of similarly tiny components surrounding it that I do not want to damage with heat from the soldering iron. Can I use aluminium foil in lieu of kapton tape to protect these components?

How can I determine BGA land pad diameter for given ball diameter?

I’m working on a project which requires the use of a CSP package. The product’s datasheet provides ball pitch and ball diameter but nothing about the preferred land pad diameter.
How can the pad diameter be worked out from these figures assuming an NSMD land?

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