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Is using a via to strengthen surface mount connector on the pad a good or bad practice?

I believe I have heard of putting a plugged via right next to a mechanical pad so that the board is stronger there. But I'm not sure what the implications are for putting a via on the pad?

There are some reasons for putting a via in the pad, but strengthening a connector is a new practice for me.

The weakest part of an SMD pad is that the copper could delaminate from the fiberglass, and lift off the PCB itself. Anything you could do to prevent that would help, including making the pad larger or putting a via in the pad itself.

But you have to be careful since putting a via in the pad can cause other issues.

  • The first problem is that it might make the pads not flat enough, so a connector pin won’t make good contact with the pad and thus not get soldered well.
  • The second issue is that the solder could get wicked down the via and leave nothing left for the connector pin. This isn’t a big issue if you are hand soldering, but can be a problem when doing it with automation.

Honestly, if connector strength is an issue, then it is advisable to seriously consider going to a through-hole connector or some type of connector, which gets strength from some other ways. Such as a connector that gets bolted to the chassis itself (and stress on the PCB is minimal).

Lees verder: SMT-montage

#PCB Design #PCB Assembly

Picture of Olivier Smit

Olivier Smit

Oliver is een ervaren elektronica-ingenieur met kennis van PCB-ontwerp, analoge circuits, ingebedde systemen, en prototyping. Zijn diepgaande kennis omvat schematisch vastleggen, firmware-codering, simulatie, indeling, testen, en probleemoplossing. Oliver blinkt uit in het omzetten van projecten van concept naar massaproductie met behulp van zijn elektrische ontwerptalenten en mechanische vaardigheden.
Picture of Olivier Smit

Olivier Smit

Oliver is een ervaren elektronica-ingenieur met kennis van PCB-ontwerp, analoge circuits, ingebedde systemen, en prototyping. Zijn diepgaande kennis omvat schematisch vastleggen, firmware-codering, simulatie, indeling, testen, en probleemoplossing. Oliver blinkt uit in het omzetten van projecten van concept naar massaproductie met behulp van zijn elektrische ontwerptalenten en mechanische vaardigheden.

Wat anderen vragen

How can I determine BGA land pad diameter for given ball diameter?

I’m working on a project which requires the use of a CSP package. The product’s datasheet provides ball pitch and ball diameter but nothing about the preferred land pad diameter.
How can the pad diameter be worked out from these figures assuming an NSMD land?

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