The soldering process for each side of the PCB is the same.
Meestal, the surface tension will be enough to hold a BGA in place, given the number of balls compared to the weight of the chip. If it is not the components will be glued, but it is quite rare to need to do it.
By design, one should avoid putting heavy components on each side of the board. On the bottom, there should only be small components.
Lees verder: Moet ik dubbellaagse PCB of enkellaagse PCB gebruiken?
#PCB Assembly #PCB Design
I’m working on a project which requires the use of a CSP package. The product’s datasheet provides ball pitch and ball diameter but nothing about the preferred land pad diameter.
How can the pad diameter be worked out from these figures assuming an NSMD land?
I see some videos online that shows via-in-pad during manufacturing. But I don’t think it is a good way, is it?
If I want to design a PCB with as much noise immunity as possible, should I leave off test points? Can PCB test points be a source of noise?
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