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How do PCB manufacturers prevent solder from entering vias during wave soldering?

I have some PCBs that were wave soldered but the vias still remain open, they are not filled nor plugged form what I can see. I do not see any solder on the annular rings of the vias either. How do they go about doing so?

Choose the right flux. There are many reasons for welding balls, but flux is the main reason.

In het algemeen, fluxes with low solid content tend to form solder balls when the underside SMD elements require double PCBA wave soldering. Because these additives are not designed to be used for long periods of time. If the flux sprayed on the PCB has been used up after the first wave crest, there is no flux after two peaks. Dus, it cannot play the function of flux and help reduce tin balls.

One of the main ways to reduce the number of welding balls is to choose a flux that can withstand longer periods of heat.

Lees verder: Beheersing van selectief solderen: Een uitgebreide gids

#PCB-assemblage

Picture of Olivier Smit

Olivier Smit

Oliver is een ervaren elektronica-ingenieur met kennis van PCB-ontwerp, analoge circuits, ingebedde systemen, en prototyping. Zijn diepgaande kennis omvat schematisch vastleggen, firmware-codering, simulatie, indeling, testen, en probleemoplossing. Oliver blinkt uit in het omzetten van projecten van concept naar massaproductie met behulp van zijn elektrische ontwerptalenten en mechanische vaardigheden.
Picture of Olivier Smit

Olivier Smit

Oliver is een ervaren elektronica-ingenieur met kennis van PCB-ontwerp, analoge circuits, ingebedde systemen, en prototyping. Zijn diepgaande kennis omvat schematisch vastleggen, firmware-codering, simulatie, indeling, testen, en probleemoplossing. Oliver blinkt uit in het omzetten van projecten van concept naar massaproductie met behulp van zijn elektrische ontwerptalenten en mechanische vaardigheden.

Wat anderen vragen

What are the black spots in lead-free solder joints on PCB?

I am prototyping a PCB, using Chip Quik’sSMDSWLF.031, a Sn96.5/ Ag3.0/ Cu0.5 solder with 2.2% no-clean flux. I find that the black spots appears frequently in larger pads on my board. I wonder if it is because I left the soldering iron more time heating the solder and that burnt the flux. What is that black residue? Is that a sign of a bad joint or maybe bad soldering technique?

Do ICs have a shelf life?

What I would like to know is if ICs also have a limited shelf life and if so, do some types suffer more than others?

Is solder mask a valid electrical insulator?

There is a copper pour over the entire top of the my PCB, which is part of GND net. It turns out that the surface mounted 1W LEDs I’m going to use have the heat slug connected internally to the LED’s +ve terminal. Can I rely on the solder mask to insulate the +ve voltage (~3V ish) from GND? Long term?

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