Schematics don’t do you much good on today’s high-tech electronics. Most high-tech electronics nowadays use custom chips or FPGAs so a schematic that shows all the signals going in and out of a magic proprietary chip won’t do you any good.
A lot of lower-tech components that perhaps use discrete parts, relais, discrete resistors, enzovoort. do have schematics on the inside of the case or available online.
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After We have assembled the Virtex-4 FPGA BGA package on our custom design PCB, we check for short circuits between all power grounding and they shows short cut between each other. Please tell us about any process for debugging this issue.
I believe I have heard of putting a plugged via right next to a mechanical pad so that the board is stronger there. But I’m not sure what the implications are for putting a via on the pad?
I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (dus, higher temperature) werkwijze?
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