BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (written) information identifying the component.
Lees verder: BGA PCB-assemblage
#PCB-assemblage
It is important to learn how to clean a circuit board properly if you’re working…
When designing PCBs, selecting the appropriate type of holes for fasteners is crucial. And much…
PCB copper foil is one of the most critical materials in the printed circuit board…
Shenzhen, China - februari 11, 2025 - MOKO-technologie, a leading global electronics manufacturing service…
While most people focus on the components and copper traces that make up PCBs, there's…
The right type of PCB material can make or break the performance of your electronics project.…