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They usually put a 3-pad solder jump.
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In the design of a power electronic PCB, I want to use a metal PCB for heat dissipation of a TO-220 package MOSFET. To do that I want to mount metal PCB on the MOSFET with the use of thermal paste and screw exactly like we do when we use heatsink for the same package. Should I leave the copper of PCB between MOSFET surface and dielectric of PCB or remove the copper surface and leave only the dielectric opening?
I required a BOM from PCB designer of manufacturer, but he sent me a Gerber. How can I open and read it?
I have a THERMAL problem when designing a power LED ALUMINUM PCB. I have 10 5W UV power LEDs.Coldwater flows through water heat sink continuously. The problem is the PCB is cold, maar LED-lampen zijn nog steeds hot? Can anyone give me some advice.
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