You can refer to the following table.
| Ball Dia. | Reduction | Land Pattern Density Level | Land Dia. | Land Variation |
| 0.15 | 15% | C | 0.13 | 0.15-0.10 |
| 0.20 | 15% | C | 0.17 | 0.20-0.14 |
| 0.25 | 20% | B | 0.20 | 0.20-0.17 |
| 0.30 | 20% | B | 0.25 | 0.25-0.20 |
| 0.35 | 20% | B | 0.30 | 0.35-0.25 |
| 0.55 | 25% | EEN | 0.40 | 0.45-0.35 |
Lees verder: BGA PCB-assemblage
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My EDA software (PCAD, but I guess others do this too) adds thermal reliefs on vias in a copper pour. What’s the use? Vias aren’t soldered.
I recently finished my PCB design files and had to release to manufacturer for order production, but I am really worry about file confidentiality leaking. How can I in this case?
To my understanding, each process in the operating system contains its own separate Process Control Block. Can someone explain this to me. Does each process have its own PCB or is there just one PCB that contains all the information for all the processes?
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