You can refer to the following table.
| Ball Dia. | Reduction | Land Pattern Density Level | Land Dia. | Land Variation |
| 0.15 | 15% | C | 0.13 | 0.15-0.10 |
| 0.20 | 15% | C | 0.17 | 0.20-0.14 |
| 0.25 | 20% | B | 0.20 | 0.20-0.17 |
| 0.30 | 20% | B | 0.25 | 0.25-0.20 |
| 0.35 | 20% | B | 0.30 | 0.35-0.25 |
| 0.55 | 25% | EEN | 0.40 | 0.45-0.35 |
Lees verder: BGA PCB-assemblage
#PCB-ontwerp
We would like to do wave soldering for the through hole components. All through hole components are top side of PCB. Only test points, which require mask during process, are on the bottom side. So there is a extra labour cost at adding and removing the mask. Can we do wave solder the through hole parts without masking it?
Soldeerpasta moet in de koelkast worden bewaard en heeft een houdbaarheidsdatum. But what exactly will go wrong when it is stored at a higher temperature or past its shelf life?
I mean, headphones or ear buds are capable of reducing the ambient background noise. Can it realize by circuit design or other approaches?
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