You can refer to the following table.
| Ball Dia. | Reduction | Land Pattern Density Level | Land Dia. | Land Variation |
| 0.15 | 15% | C | 0.13 | 0.15-0.10 |
| 0.20 | 15% | C | 0.17 | 0.20-0.14 |
| 0.25 | 20% | B | 0.20 | 0.20-0.17 |
| 0.30 | 20% | B | 0.25 | 0.25-0.20 |
| 0.35 | 20% | B | 0.30 | 0.35-0.25 |
| 0.55 | 25% | EEN | 0.40 | 0.45-0.35 |
Lees verder: BGA PCB-assemblage
#PCB-ontwerp
Al het soldeerwerk dat ik tot nu toe heb gedaan, is met doorlopende componenten. Ik hoop op een bepaald moment in de toekomst over te stappen op enkele kleinere onderdelen voor opbouwmontage. I’ve got a Weller WES51 soldering station. There is a large number of ET series tips available. How do I choose the right tip for the components I’ll be working with?
Some online tutorials about soldering TH components, like transistors and ICs, are delicate components and can be easily damaged by heat. When it comes to soldering surface mount IC and components, some prefer to use a reflow oven which heats up the them to a temperature above the melting point of solder. So why?
I am learning to design a multiple layer board for a medical device, and have a question about where the ground should place.
markten
Middelen
Neem contact op
Copyright ©2025 MOKO Technology | Uw vertrouwde EMS-partner Guangdong ICP Nr. 15085690
