PCB-assemblage

Can leaded BGA chips be reflow soldered with lead-free process?

Option 1: Talk to your assembler and see if you could use two different temperature processes.

  • Do the Lead-free profile first (that goes to a higher temperature)
  • Vervolgens, after those parts are done, solder the leaded parts on with a leaded temperature profile.

This satisfies the requirements of both. (you don’t need to worry about stenciling as BGA’s have solder balls)

DEption 2

Install lead-free BGA’s with an IR rework station (which also supports temperature profiles). It is more difficult but possible.

Lees verder: Inzicht in verschillende soorten BGA-pakketten

#PCB-assemblage

Olivier Smit

Oliver is een ervaren elektronica-ingenieur met kennis van PCB-ontwerp, analoge circuits, ingebedde systemen, en prototyping. Zijn diepgaande kennis omvat schematisch vastleggen, firmware-codering, simulatie, indeling, testen, en probleemoplossing. Oliver blinkt uit in het omzetten van projecten van concept naar massaproductie met behulp van zijn elektrische ontwerptalenten en mechanische vaardigheden.

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