Can leaded BGA chips be reflow soldered with lead-free process?

I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (dus, higher temperature) werkwijze?

Option 1: Talk to your assembler and see if you could use two different temperature processes.

  • Do the Lead-free profile first (that goes to a higher temperature)
  • Vervolgens, after those parts are done, solder the leaded parts on with a leaded temperature profile.

This satisfies the requirements of both. (you don’t need to worry about stenciling as BGA’s have solder balls)

DEption 2

Install lead-free BGA’s with an IR rework station (which also supports temperature profiles). It is more difficult but possible.

Lees verder: Inzicht in verschillende soorten BGA-pakketten

#PCB-assemblage

Picture of Olivier Smit

Olivier Smit

Oliver is een ervaren elektronica-ingenieur met kennis van PCB-ontwerp, analoge circuits, ingebedde systemen, en prototyping. Zijn diepgaande kennis omvat schematisch vastleggen, firmware-codering, simulatie, indeling, testen, en probleemoplossing. Oliver blinkt uit in het omzetten van projecten van concept naar massaproductie met behulp van zijn elektrische ontwerptalenten en mechanische vaardigheden.
Picture of Olivier Smit

Olivier Smit

Oliver is een ervaren elektronica-ingenieur met kennis van PCB-ontwerp, analoge circuits, ingebedde systemen, en prototyping. Zijn diepgaande kennis omvat schematisch vastleggen, firmware-codering, simulatie, indeling, testen, en probleemoplossing. Oliver blinkt uit in het omzetten van projecten van concept naar massaproductie met behulp van zijn elektrische ontwerptalenten en mechanische vaardigheden.

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