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Oliver is an experienced electronics engineer with over 7 years of experience developing products in IoT, consumentenelektronica, and medical devices. He is highly skilled in analog circuit design, ingebedde systemen, PCB-indeling, firmware-codering, and prototyping electronic products. Oliver’s expertise encompasses the full product development cycle, from concept to mass production. He holds a Master’s degree in Electrical Engineering and leverages his deep technical knowledge to deliver innovative electronic solutions.

Check Out My Latest Blogs

Is het oké om een ​​VIA in een Flex PBC te buigen??

On a Flex Printed Circuit (FPC) made out of Kapton polyimide, will anything bad happen if I put a VIA in a part of the FPC that has to bend? VIA size: 0.2 mm hole diameter in 0.4 mm copper diameter. FPC bend radius: 0.7 mm. Kapton thickness: 0.2 mm. Copper weight: either 2 oz or 1 oz (I haven’t decided yet)

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