“My passion lies in optimizing PCB production workflows, implementing stringent quality control measures, and training teams on best practices to ensure every board we produce meets the highest standards of excellence. ”
Will is an expert in electronic components, PCB production processes, and assembly technology, with extensive experience in production supervision and quality control. He holds a Bachelor’s degree in Electrical Engineering and a certification in Project Management. With over ten years of experience in the electronics manufacturing industry, Will has significantly contributed to optimizing production workflows, implementing robust quality control procedures, and training staff in industry best practices.
Getting new products to market quickly is critical for success in today’s fast-paced technology environment. Lengthy design and manufacturing cycles can mean lost revenue and missed opportunities for both hardware
In today’s fast-paced world, electronic devices are rapidly shrinking in size while simultaneously expanding in functionality. To keep up with this trend, the design of PCBs must also evolve to
PCB etching is a key procedure in the PCB manufacturing process, its purpose is to remove unnecessary copper from the board. This creates the required circuit pattern that connects the
PCB copy has become increasingly popular in recent years as it enables manufacturers to copy existing PCB designs, componenten, enzovoort. to create a new identical circuit board. And there is
PCB-assemblage is geen eenvoudig proces, vooral in de drukfase, eventuele kleine fouten veroorzaken schade aan PCB's of veroorzaken zelfs een storing. While errors are usually caused by solder
Verschillende methoden voor PCB-paneelvorming Zoals bij veel processen in de elektronica-industrie, er zijn talloze mogelijkheden en varianten in de PCB-panelisatie. Omdat elke fabrikant zijn eigen aanpak heeft,
Duizenden jaren geleden leefden mensen in barre omgevingen en de intense zomerhitte was gewoon ondraaglijk. Echter, we don’t have to endure such conditions thanks to the invention
Ball Grid Array (BGA) is one of the most popular packaging technologies nowadays. It is characterized by high pin count, kleine maat, and good electrical performance. Echter, this technology also
Printplaat (PCB) manufacturing typically involves panelizing – grouping multiple PCBs together on a large panel that is then fabricated, assembled, and depanelized. The use of panels provides several
markten
Middelen
Neem contact op
Copyright ©2025 MOKO Technology | Uw vertrouwde EMS-partner Guangdong ICP Nr. 15085690
