明らかに湿気を取り除くためです, おそらく、蒸気が BGA または CSP パッケージをボードから押し出すのを防ぐためです。 (おそらくテント状のビアに閉じ込められた湿気によるものでしょう, マイクロビアまたはその他の場所).
続きを読む: プリント基板のみ: 定義の初心者ガイド, 利点, とテスト
#PCB製造
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