PCBアセンブリ

マスクレイヤーを貼り付けます, 上層と下層の両方, THTコンポーネントに必要?

番号. Paste mask is normally used only for reflowing surface mount components, while the through hole components are soldered either manually or by wave solder bath at a later stage.

If you have through hole parts and the surface mount components on the bottom side, the paste mask stencil is not required, as the parts will all be soldered at once in a wave solder bath. This process requires you to generate a glue dot coordinates file, which will be used to place a dot of glue under the surface mount component and that will keep the part in place during the soldering process.

If the only through hole parts in the PCB were the connectors, it is also possible to reflow through hole components with solder paste. That requires some tweaking to get the right pad size and stencil opening. All we need to do is to have a larger pad on the top side, so that there was enough paste on the pad to wick down the hole and ensure a solid solder joint.

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オリバーは、PCB 設計に熟練した経験豊富なエレクトロニクス エンジニアです。, アナログ回路, 組み込みシステム, とプロトタイピング. 彼の深い知識は概略図のキャプチャに及びます, ファームウェアコーディング, シミュレーション, レイアウト, テスト, そしてトラブルシューティング. オリバーは、電気設計の才能と機械の適性を活かして、プロジェクトをコンセプトから量産まで進めることに優れています。.

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