BGA reballing emerges as a critical repair technique for modern electronic devices. 最近は, electronic devices are becoming increasingly complex and versatile to meet evolving user demands. These devices often rely on ボール・グリッド・アレイ (BGA) パッケージ for efficient functionality. しかしながら, over time, BGAs may develop issues that require precise rework solutions. This is where BGA reballing comes into play. このブログでは, we’ll explore what BGA reballing is, why it is essential, the tools required, and the step-by-step process involved.
What Is BGA Reballing?
BGA reballing is a process to replace the solder balls on a Ball Grid Array package. 最初, let’s figure out what BGA is. It is a surface-mount packaging that is featured with an array of tiny solder balls on the underside, commonly used for integrated circuits to provide electrical and mechanical connections to the PCB. しかしながら, its solder balls may counter degrade, crack or become contaminated over time, which would cause connectivity issues and affect devices’ performance. And reballing is a useful method to fix it by replacing the damaged solders balls with new ones.
Why Is BGA Reballing Needed?
BGA reballing becomes essential for several reasons:
- Repair of Damaged Solder Balls
Solder ball conductivity can be broken or severed by stress, thermal cycling and aging. など, we can rely on BGA reballing method to restore functionality of components rather than replacement.
- Reuse of Expensive Components
When we deal with some faulty circuit boards, we can reuse these high-value components like processors or GPU by reballing to decrease costs.
- Correction of Manufacturing Defects
生産中, if there are misaligned or improperly formed solder balls, the BGAs would get defected. And BGA reballing can correct these issues, which is one of the major uses of BGA reballing process.
- Refurbishment of Electronics
BGA reballing is a major process in the refurbishment (やり直し) 業界, which is used to restore functionality for used or defective electronic components.
Tools Required during the BGA Reballing
To carry out the raballing process well, we need to use the right tools. Let us look at some of the tools that are needed for reballing:
- はんだごて
A soldering iron is a hand held device that delivers heat to the solder material which melts the solder to form strong connections between components and the BGA PCB assembly. Its top is the soldering iron tip to heat the solder precisely, and its handle is insulated to ensure safe handling.
- Desoldering Wire
Desoldering wire, also known as solder wick, is a tool used to remove unwanted solder. Heat the wire, and when the molten solder is absorbed in the wire, it is easier to clean off the area. It is usually made of a fine copper braid coated with rosin flux, 通常 18 に 42 AWG in thickness.
- BGA Reballing Station
It is a specialized workstation designed for performing BGA reballing tasks. This station includes holders that are used to secure BGA components, heating tools to soften the solder, そして SMT stencils to ensure uniform solder balls.
- Solder Balls
Solder balls are small spherical pieces of solder placed on the underside of a BGA (ボール・グリッド・アレイ) パッケージ. During the assembly process, the solder balls melt and solidify, forming reliable joints between the BGA and the PCB.
BGA Reballing Process: 7 Key Steps Involved
BGA reballing is a skill and accuracy required, complex multi stage operation. Here is an overview of the steps involved:
ステップ 1: 準備
Technicians look at the BGA chip for visible damage before starting. Then clean the original surface and ensure the component is ready for reballing.
ステップ 2: Solder Balls Removal
We have to remove the original solder balls in this stage. This can be achieved using both a hot air rework station or an IR reflow oven.
ステップ 3: Cleaning the BGA Package
その後, remove residual solder and contaminants from the underside of the BGA package. This can be done by flux, solder wick or a desoldering tool. Finally we have a clean, flat surface for the new solder balls.
ステップ 4: Reballing
Put stencils over the BGA components, then place the preformed solder balls accurately or applying soldering paste so as to create new solder balls.
ステップ 5: Reflowing the Solder Balls
BGA package is heated using a rework station or reflow oven to melt the solder balls, so they can be mounted onto the component firmly. As far as temperature goes, it should run in this range from 220°C to 250°C to avoid overheating.
ステップ 6: 検査
When the re-balled BGA components are cooling down,technicians use a microscope to check if there is any issue, ensuring that all solder balls are formed and aligned properly.
ステップ 7: Reinstallation
The re-balled BGA is mounted back onto the PCB via a rework station. The connections are checked and verified for correct working.
Choosing MOKO Technology for BGA Reballing Service
MOKO Technology is the company that provides BGA reballing services and has rich experienced in PCB assembly and repair. We are capable of salvaging high value components, remedying manufacturing defects, and meeting specified soldering requirements, and we do all this with fast turnaround, competitive pricing and superb service backed by a wide array of equipment, trained and qualified technicians. If you’d like to talk to us about your BGA reballing inquiries, reach out to us today.
