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オリバー・スミス

テクニカルライター

Oliver is an experienced electronics engineer with over 7 years of experience developing products in IoT, 家電, および医療機器. He is highly skilled in analog circuit design, 組み込みシステム, PCBレイアウト, ファームウェアコーディング, and prototyping electronic products. Oliver’s expertise encompasses the full product development cycle, from concept to mass production. He holds a Master’s degree in Electrical Engineering and leverages his deep technical knowledge to deliver innovative electronic solutions.

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有鉛BGAチップを鉛フリープロセスでリフローはんだ付けできますか?

鉛フリー BGA チップに有鉛プロセスを使用することは受け入れられないことを知っています, BGA のはんだボールが溶けず、接合の信頼性が低下するためです。. しかし現在、BGA チップは鉛フリー ボールでのみ入手可能です. 有鉛BGAチップを鉛フリーとはんだ付けしても大丈夫ですか? (したがって、, より高い温度) 処理する?

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