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オリバー・スミス

テクニカルライター

Oliver is an experienced electronics engineer with over 7 years of experience developing products in IoT, 家電, および医療機器. He is highly skilled in analog circuit design, 組み込みシステム, PCBレイアウト, ファームウェアコーディング, and prototyping electronic products. Oliver’s expertise encompasses the full product development cycle, from concept to mass production. He holds a Master’s degree in Electrical Engineering and leverages his deep technical knowledge to deliver innovative electronic solutions.

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Flex PBC で VIA を曲げても大丈夫ですか??

フレックスプリント基板上 (FPC) カプトンポリイミド製, FPCの曲げる部分にVIAを入れると何か悪いことが起こりますか?? VIAサイズ: 0.2 穴径 mm 0.4 銅の直径 mm. FPCの曲げ半径: 0.7 んん. カプトンの厚さ: 0.2 んん. 銅の重量: どちらか 2 オンスまたは 1 オズ (まだ決めていません)

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