The soldering process for each side of the PCB is the same.
Generalmente, the surface tension will be enough to hold a BGA in place, given the number of balls compared to the weight of the chip. If it is not the components will be glued, but it is quite rare to need to do it.
By design, one should avoid putting heavy components on each side of the board. On the bottom, there should only be small components.
Leggi di più: Dovrei usare PCB a doppio strato o PCB a strato singolo?
#Assemblaggio PCB #Progettazione PCB
Impedance matching has become a cornerstone of the signal integrity in the realm of high speed PCB…
It is important to learn how to clean a circuit board properly if you’re working…
When designing PCBs, selecting the appropriate type of holes for fasteners is crucial. And much…
PCB copper foil is one of the most critical materials in the printed circuit board…
Shenzhen, Cina - febbraio 11, 2025 - Tecnologia MOKO, a leading global electronics manufacturing service…
While most people focus on the components and copper traces that make up PCBs, there's…