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BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (scritto) information identifying the component.
Leggi di più: Assemblaggio PCB BGA
#Assemblaggio PCB
Sono fai-da-te una palla rotonda intelligente. E voglio un PCB con bordo arrotondato che si adatti alla forma del dispositivo. Quindi è una cosa possibile nel campo della produzione di PCB?
Sto progettando un PCB con 1088 pin BGA IC. Non ho gestito un circuito integrato così grande. Non sono sicuro della migliore quantità di livello.
Ho un lotto di PCB con dadi SMT che è stato assemblato su un PCB – il dado ha un nastro kapton sulla parte superiore per consentire un facile prelievo per il montaggio. Come possiamo farlo più velocemente/qual è il metodo migliore??
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