Customize Consent Preferences

We use cookies to help you navigate efficiently and perform certain functions. You will find detailed information about all cookies under each consent category below.

The cookies that are categorized as "Necessary" are stored on your browser as they are essential for enabling the basic functionalities of the site. ... 

Always Active

Necessary cookies are required to enable the basic features of this site, such as providing secure log-in or adjusting your consent preferences. These cookies do not store any personally identifiable data.

No cookies to display.

Functional cookies help perform certain functionalities like sharing the content of the website on social media platforms, collecting feedback, and other third-party features.

No cookies to display.

Analytical cookies are used to understand how visitors interact with the website. These cookies help provide information on metrics such as the number of visitors, bounce rate, traffic source, etc.

No cookies to display.

Performance cookies are used to understand and analyze the key performance indexes of the website which helps in delivering a better user experience for the visitors.

No cookies to display.

Advertisement cookies are used to provide visitors with customized advertisements based on the pages you visited previously and to analyze the effectiveness of the ad campaigns.

No cookies to display.

How much larger should a plated-through hole be than lead diameter to get good solder wetting?

I'm designing a new PCB where I have a whack of connectors that have to line up with the metalwork. There are some problematic connectors. All 4 pins are round. I want to have the holes as small as possible while allowing for good solder adhesion over the full length of the pin. I'm looking for guidance on how much clearance around the component lead I should have in order to get good solder wetting and adhesion.

I don’t think you should depend on the holes to locate the part when tolerances are important. I think 10-15 mils is good solution(in metric 0.25 to 0.4mm).

Make up a jig to hold the parts in the proper location while they are being soldered. It can be fancy for wave soldering or something simple that holds the parts while being hand soldered (perhaps fashioned from the mating part such as the punched chassis).

Round pins are a particular hassle if you call it too close- at least with square or rectangular pins you can skive off some plating inside the holes at the corners of the pin and still force the pin in. If you insist on the using the holes, maybe make the peg round and the hole square (call out slot-drilled square holes in the PCB).

Read More: THT PCB Assembly

#PCB Assembly

Picture of Oliver Smith

Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.
Picture of Oliver Smith

Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.

What Others Are Asking

Can we do wave solder the through hole parts without masking it?

We would like to do wave soldering for the through hole components. All through hole components are top side of PCB. Only test points, which require mask during process, are on the bottom side. So there is a extra labour cost at adding and removing the mask. Can we do wave solder the through hole parts without masking it?

How can I determine BGA land pad diameter for given ball diameter?

I’m working on a project which requires the use of a CSP package. The product’s datasheet provides ball pitch and ball diameter but nothing about the preferred land pad diameter.
How can the pad diameter be worked out from these figures assuming an NSMD land?

Read Detailed Advice From Blog Articles