The soldering process for each side of the PCB is the same.
Usually, the surface tension will be enough to hold a BGA in place, given the number of balls compared to the weight of the chip. If it is not the components will be glued, but it is quite rare to need to do it.
By design, one should avoid putting heavy components on each side of the board. On the bottom, there should only be small components.
Read More: Should I Use Double Layer PCB or Single Layer PCB?
#PCB Assembly #PCB Design
Last week we visited a PCBA factory. We were looking at reflow ovens. A lot of them have a metal conveyor belt the boards sit on. On a double sided board, when you put the board on the metal belt, won’t the metal belt knock components off as they are only held on by paste?
I am designing a 2 layer PCB with components on both side of it. SMT components are one one side of PCB, but TH (through hole) components are on both sides. I need to understanding something mentioned by the supplier called primary and secondary sides.
I receive an email from My PCBA suppliers. They advised us to adjust our original PCB design. Are there any PCB designer have this experience after releasing original design to your supplier? If yes, do you think that the manufacturer can make your design better?
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