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The soldering process for each side of the PCB is the same.
Usually, the surface tension will be enough to hold a BGA in place, given the number of balls compared to the weight of the chip. If it is not the components will be glued, but it is quite rare to need to do it.
By design, one should avoid putting heavy components on each side of the board. On the bottom, there should only be small components.
Read More: Should I Use Double Layer PCB or Single Layer PCB?
#PCB Assembly #PCB Design
I have three through-hole PCBs that are missing front and back solder mask openings for two of the components. The solder mask (usually green) is covering the front and back solder pads. All other pads for all other parts are exposed. Is there a good way to remove the solder mask so that I can solder the components to the board?
I find that the all types of PCB samples from my suppliers have ground planes. It seems important and I want to know about its function.
I’ve ordered fabrication and assembly of small PCB batches (100pcs) a couple of times already. Each time the factory asked me if I want to do test on the PCB. But I don’t what to do about it. And I test them by myself. Then, the result of the testing is unacceptable with 15% soldering problems. So bad. I think I will ask the supplier to test them before delivery.
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